Kingmax stellt neue DDR2 Module in neuem Gewand vor
Dienstag, 08. Nov. 2005 16:51 - [al] - Quelle: Der Speicherhersteller Kingmax stellt heute zwei neue DDR2 Riegel vor. Zum einen die DDR2 Long-DIMM Serie "Mars" und zum anderen die SO-DIMM Serie "Venus".
Pressemitteilung
The Age of DDRII – Technology is King
How memory module manufacturers will overcome packaging technology bottlenecks
KINGMAX,Taipei Nov
8
,2005
–
Computer hardware technology is constantly being upgraded or replaced because of the lightning speed of technological advances. The pace of change is especially remarkable in motherboards, graphics cards and processors -- but as the operating platforms advance so do requirements for memory modules, as memory performance is
closely tied to the overall computation performance of the system.
Even with the latest and fastest hardware, if the memory is not able to keep up, bottlenecks will occur during software operating processes. As the technology advances, memory module manufacturers are well aware of the crucial role memory plays in technology development. To accommodate continuing hardware advances in the future, memory module manufacturers have responded swiftly by releasing an all-new memory architecture: DDR2 memory.
DDR2 is a new generation memory technology standard defined by
JEDEC. One of the
major differences between DDR1 and
DDR2 is the 4-bit Prefetch technology
, which significantly increases memory bandwidth to overcome computational bottlenecks.
Memory makers are now looking to release DDR2 specification products for the standard PC market at 533MHz
,
667MHz and even 800MHz bandwidth levels.
DDR2 has several advantages over
DDR
1: first, DDR2 includes
4-bit
Prefetch
, whereas
DDR1 contained 2-bit
Prefetch
.
DDR
2 has double the data transmission speed of
DDR
1, which provides
higher capacity to pre-read system command data and allows access to more complete
data transfer capacity. Second,
DDR2 also includes three new technologies: OCD
,
ODT
and
Post CAS
. These technologies vastly reduce memory bottlenecks for applications and data transfer.
Most importantly, DDR2 is far superior to DDR1 in its packaging format.
BGA packaged chips have more space at the bottom of the chip, allowing for the denser I/O requirements necessary for DDR2 performance.
Additionally,
BGA packaging provides easier chip assembly, improved electricity performance and reduced signal latency to permit higher frequency operation and superior heat dispersion.
The application of BGA packaging brought about a revolution in memory chip packaging.
During the
DDR
1
era,
UTT
(
Untested
)
DRAM
chips appeared throughout the
DRAM industry. Upstream DRAM IC manufacturers had difficulty preventing the appearance of UTT chips, and this became a fact of life for the
memory industry
.
Many smaller downstream companies used traditional TSOP packaging because of its lower cost and relied on mass produced, lower quality UTT chips to produce RAM, which resulted in substandard products for the consumer.
But as we entered the age of
DDR
2, speed and heat dispersion requirements necessitated discussions between
DRAM
makers,
OEM
PC makers and CPU giant
Intel, which resulted in a decision to use BGA packaging for next-generation DDR2 memory. BGA packaging would allow DDR2 ICs to fully realize their performance potential.
This decision implied a major challenge for companies accustomed to UTT manufacturing, as most of these suppliers were using TSOP packaging and had no experience in producing or repairing BGA packaged DRAM modules. As soon as a customer requested repair, the manufacturer would lack the personnel and equipment to solve the problem. Therefore they were unable to provide real quality products or services to the consumer.
To understand the application of BGA packaging in DDR2 manufacturing, we must first examine the memory manufacturing process. The main steps of the process include: wafer dicing and testing; packaging;
chip testing;
SMT
; finished product testing; and shipment. The most critical step in this process is the memory IC production phase, in which the chip must undergo pre-processing, post-processing, inspection, packaging and testing to qualify as a “good chip.”
The pre-processing stage involves wafer dicing to cut the wafer into small chips and basic EDS testing. The post-processing stage involves I/O (input/output) assembly and securing. The inspection process includes overall testing of the entire chip. Finally, chips that have passed the inspection process are packaged into finished memory chips. The finished chips are then tested once more to ensure that the finished product meets strict performance, stability and compatibility requirements.
In the
DDR
1 era, many small and medium-sized companies bought packaged chips directly and used simple SMT processing to make completed memory modules for sale on the open market. The majority of these chips were UTT chips. But in the
DDR
2 era, this method is no longer practicable due to the use of BGA packaging. Only companies who can maintain upstream and midstream technologies are able to maintain their competitive advantage. This fact also implies that in the DDR2 era,
only those companies with
BGA packaging technology can stand firmly in the future competition.
Even companies who had strong advantages in the DDR1 era cannot maintain those advantages in the DDR2 era without the ability to invest more capital and human resources to meet the changing market demands. In contrast,
those companies who have accumulated years of experience and technologies, and who possess the core BGA packaging technologies,
will gradually receive broader market approval.
Kingmax is one such company.
As a global leader in the memory industry, Kingmax is the world’s first memory manufacturer to possess its own advanced packaging and testing equipment and complete vertical supply chain integration. Therefore, after
Kingmax purchases the wafers from the original wafer fab, the entire memory manufacturing process is completed in Kingmax’s own independent packaging facilities. Out of the many memory manufacturers in the industry today,
only Kingmax developed BGA packaging as early as seven years ago and began successfully applying the technology in both its SDRAM and DDR product lines. Kingmax used BGA packaging as early as the time of
SDRAM PC66/100, when the technology had previously been reserved for higher-end semiconductor products such as CPUs.
Kingmax’s unique patented technology
—TinyBGA packaging—is another remarkable achievement that has been widely acclaimed throughout the industry. This wealth of experience and its strong foundations in the technology allowed Kingmax to fully master the challenges of BGA packaging and to become a global leader in the DDR2 era.
K
ingmax also possesses impressive strength in the testing field.
In the second quarter of this year,
Kingmax invested nearly USUSD 10 million to purchase
ADVANTEST
T5593 testing equipment. Very few other memory manufacturers have installed this high tech testing machinery due to its high cost – even specialized IC packaging and testing suppliers can provide only limited testing capacity. But as Kingmax sees itself as the leading manufacturer in the memory industry, it is willing to invest heavily in R&D, testing and production equipment.
With the
T5593,
Kingmax is able to to screen for memory chips that can reliably achieve up to
800MHz or higher
through rigorous testing
, enabling mass production of the highest quality DDRII-800 memory modules. For Kingmax
, this means maintaining full control of the initiative in the market and standing at the forefront of the industry using its own technology advantages.
As DDR2 products continue to gain market popularity, DDR1 is fast fading into history and the age of DDR2 is now upon us. With the arrival of this new age, “technology is king” is fast becoming a hallmark slogan in the industry.
Whoever possesses the necessary technologies earliest enjoys first-mover advantage and wields a formidable weapon for continued growth.
Please see Kingmax's official
website for more detailed information on our entire product range.
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