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VIA verdoppelt Bandbreite von DDR-RAM

Dienstag, 17. Sep. 2002 15:50 - [fs] - Quelle:

VIA hat heute in einer Pressemitteilung bekanntgegeben, dass man sich mit Kentron Technologies über eine Lizenz für Quad Band Memora (QBM) geeinigt habe. Mit dieser Technik kann die Transferrate im Vergleich zu DDR-RAM verdoppelt werden, ohne den Takt zu erhöhen.

Pressemitteilung VIA and S3 Graphics Announce License Agreement with Kentron Technologies for DDR based, Quad Band Memory (QBM) Technology Incorporating QBM technology into core logic chipsets effectively doubles the bandwidth of current DDR SDRAM devices, demonstrating VIA's continued leadership in delivering higher PC system performance through evolutionary memory technology Taipei, Taiwan, 17 September 2002 - VIA Technologies, Inc., a leading innovator and developer of silicon chip technologies and PC platform solutions, and S3 Graphics, Inc. today jointly announced the licensing of QBM technology from Kentron Technologies. The adoption of QBM technology reflects the continuation of VIA's industry defining strategy of driving evolutionary memory technologies into the market in order to deliver higher system performance with a minimal cost penalty, as demonstrated in the successful transitions to PC133 SDRAM in 1999 and DDR SDRAM in 2001. The QBM controller interface license provides VIA and S3 Graphics with the necessary IP coverage to incorporate QBM into their line of core logic chipsets. QBM technology doubles the speed of Double Data Rate (DDR) memory devices while maintaining the existing 64-bit bus structure common in today's general purpose computing systems and meeting market requirements for low cost memory modules. This license marks the first time that PC based systems will be able to interface to high speed DDR533 and DDR667 modules featuring QBM technology. New systems using QBM enabled chipsets from VIA and S3 Graphics will combine the fastest speed memory in the industry with the fastest processor bus speeds and maintain backward compatibility with today's DDR modules. "VIA is committed to delivering higher performance chipset solutions to the marketplace while minimizing cost impact on our customers," said Chewei Lin, Vice President of Product Marketing, VIA Technologies, Inc. "Kentron's leading edge QBM memory technology will enable us to strengthen our position as the market leader in providing high-performance chipsets and, at the same time, exploit all the potential of the existing DDR SDRAM infrastructure." "We are looking forward to a long and mutually beneficial relationship with VIA and S3 Graphics," said Bob Goodman, Kentron Technologies' chief executive officer. "As a developer of high speed and high density memory solutions, Kentron's objective is to produce innovations that will benefit the semiconductor and system industries." "Kentron's QBM technology implemented with VIA and S3 chipsets will raise the performance bar and deliver the highest bandwidth achievable in a low cost 64-bit DDR configuration. Compared to the other high performance alternatives, this architecture could produce the best price/performance for several years to come," said Bert McComas, founder and principle analyst at InQuest Market Research. In order to ensure a worldwide low cost supply of DDR based QBM modules in support of VIA's chipsets, Kentron is providing the major DRAM and memory module manufacturers with the necessary tools (modules, gerbers, design guides, etc.) under a royalty-free license. "QBM enabled chipsets from VIA and S3 Graphics mark a major milestone toward the implementation of QBM technology," said Jun Kitano, Director of Technical Marketing for Elpida Memory (USA) Inc. "Elpida will continue to work closely with Kentron Technologies by offering high density, low power DDR SDRAM devices." Other partners in The QBM Alliance, such as STMicroelectronics and Acuid Corporation have been working closely with both Kentron Technologies and VIA in the activities targeted towards the development of QBM enabled chipsets. "STMicroelectronics has been a member of the QBM Alliance since the beginning and we are pleased to be providing key components used in the QBM solution being brought to the marketplace by VIA, S3 Graphics and Kentron Technologies," said Ricardo de Sa Earp, Director of Marketing at ST Microelectronics' ASD & Discretes Division. "Acuid clearly recognize the advantages that the QBM technology brings to the system market place and the requirement for advanced testing solutions," said Ricci Brach, VP ATE Marketing and Sales North America at Acuid Corporation Ltd. "The move by VIA and S3 Graphics to incorporate QBM into their chipset products will have a very positive impact on the acceptance of the QBM technology in the marketplace."
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