Shuttle präsentiert ersten AMD-Barebone

Pressemitteilung Shuttle Launches World's First AMD Small Form Factor with AGP Shuttle Inc., a leading provider of innovative mainboards, barebones, and accessories, today announced another ground-breaking Small Form Factor (SFF) system. Continuing Shuttle's small form factor leadership, the XPC SK41G is the first SFF system to support powerful AMD Athlon™ XP 2600+ processors, paired with advanced AGP4X graphics cards. "The AMD Athlon XP processor provides a blend of performance and power consumption for small form factor applications like the Shuttle XPC SK41G" said Ed Gasiorowski, director of AMD Infrastructure Enablement Group. "Shuttle continues to innovate beyond the traditional beige box form factor, and combined with AMD processing power Shuttle provides customers with a new 'all-in-one' PC form factor based on the AMD Athlon XP processor.” Measuring only 300mm (L) by 200mm (H) by 185mm (W), the XPC SK41G is the smallest full featured AMD Athlon desktop available. Utilizing the proven VIA KM266 chipset, the XPC SK41G features ProSavage 8 video, complete with VGA and S-Video/composite connectors. The XPC SK41G also uses the latest VIA VT8235 southbridge, complemented by the VIA Fire II IEEE-1394 controller, enabling six USB2.0 port and three Firewire™ port connectivity. "The innovative design of the Shuttle XPC SK41G featuring the VIA KM266 chipset demonstrates that small form factor systems need not sacrifice any computing power or connectivity, compared to standard desktop systems" commented Richard Brown, Director of Marketing, VIA Technologies, Inc. "The VIA KM266 Chipset gives end users the flexibility to use the integrated ProSavage8 graphics or opt for an AGP graphics card, as well as a fast DDR memory subsystem and great connectivity through USB 2.0 and ATA-133" The XPC SK41G also includes an improved Integrated Cooling Engine, Shuttle's patented technology which enables fanless operation of AMD Athlon XP™ processors. The improved I.C.E. technology is complemented by an improved case design which greatly increases cooling efficiency for a new generation of high capacity hard drives and higher speed memory.