Handys mit 1,3 Megapixel Digital-Kamera

Pressemitteilung SAMSUNG Develops 1.3M Pixel CMOS Image Sensor Chip SAMSUNG Electronics Develops - High Quality 1.3M Pixel CMOS Image Sensor Chip Seoul Korea, November 24, 2003- SAMSUNG Electronics Co., Ltd., a leader in advanced semiconductor technology, today announced the development of its high-quality CMOS image sensor (CIS) chips and camera modules. The 1/3-inch, SXGA(1.3mega pixel) and a 1/5.8-inch, VGA(330,000 pixel) camera module ,including the CIS and ISP(Image Signal Processor) chips, will be available in mass production in December 2003. According to market researcher TSR, the camera phone market is expected to reach 65million units in 2003 and grow to 217million units by 2007 showing a growth rate of 35 percent. SAMSUNG's new enhanced imaging technology will bring image quality to superior level not only for high-resolution camera phones, but also for current and emerging industrial applications that require cost effective image capturing solutions. Vice President Lee Yong-hee of the imaging project team at SAMSUNG Electronics, says, “SAMSUNG's new technology resolves the debate over image quality between CIS chips and CCDs (Charge Coupled Device). SAMSUNG's new mega-pixel CIS device lets us diversify our product portfolio to better accommodate customers’ requirements for high-performance, low-power multi-function devices. Moreover, applications for our new image sensor are not confined to just mobile phones, camcorders and digital cameras. We expect this device to become a core component in automobiles, bioengineering, robotics and medical services.” Image quality today is mainly determined by the resolution, light sensitivity, and noise level of individual pixels. Unlike common CIS chips that rely on high SXGA resolution density, SAMSUNG's has come out with a new high quality CIS chip placing its performance on par with CCDs. The minimum illumination rating for Samung’s new CIS chipset is below 2 lux, which complies with the EIA (Electronics Industries Alliance) standard method less than one tenth of the 10 to 20, or above, lux levels found in current CIS chips. This is also equivalent to that of CCDs. The light sensitivity characteristic enables end users to take clearer and crisper images in even the dimmest environment and will enable digital still camera-quality photo images on mobile phones. SAMSUNG achieved technical breakthroughs on its CIS chip using its proprietary active pixel sensor and analog-to-digital converter circuit processing technologies. Through this process, a low dark current level (~20e/sec @RT), and low random noise level (<10e) ensuring a high signal-to-noise ratio, and high sensitivity (1.8V/lx-sec) is achieved. This approach enhances the chipset's performance by minimizing the level of illumination to below 2 lux. Finally, because high-performance and low power are key design requirements for today's mobile appliances, and are driving the demand for CIS chips, SAMSUNG maintains the lowest power consumption levels through a 1.8V design process. At 24MHz, 1.3million pixel images are reproduced at 15 frames per second lowering power consumption levels down to as low as 72m Watt.